According to a new report, the rumored Samsung Galaxy S9 may come with a new kind of motherboard, based on the SLP (Substrate Like PCB) tech. This technology allows manufacturers to fit additional components onto a single board by lowering their mark and allowing for extra component layer, retaining the size of the board at the same time.

Samsung is pursuing this tech so that it can fit a bigger battery in its upcoming Galaxy S device without making the handset heavier. But according to a source, this new technology would only be used for the units powered by the Exynos chipset; the Qualcomm versions will still make use of the less-efficient HDI (High-Density Interconnect) tech.

Not much has separated the Qualcomm variations from the Exynos versions of Samsung’s devices, other than few minor performance differences. If the two Samsung Galaxy S9 versions employ different motherboards, it implies that the device may have different size batteries as well or have different sizes of bodies. Stay tuned to learn more about Samsung Galaxy S9 specs and other details.