The news making the most hits online is the Qualcomm Snapdragon 810 overheating issues due to which Samsung has been avoiding it for its next flagship. So far this is a cliché because Samsung using Exynos chipset can be meant for more self-reliance. Also the LG Vice President seems pretty confident with Snapdragon 810 and has said that they can work around the issue even if there is any. For this reason Qualcomm is planning for a redesign of the chipset to overcome the issue anytime near March specifically for Samsung as the new flagship is expected to be showcased at MWC. As far as the LG is concerned they have been giving voice that only CPU does not has the responsibility of monitoring heat levels, it is also how the device is designed that dissipates heat. That is why LG G Flex 2 might be designed in way to keep heat levels which LG thinks optimal. However what is in the mind of Sammy while leaving Qualcomm’s chips is still unknown as no words is yet uttered by official sources on any of its decisions.

Qualcomm redesigning its Snapdragon 810 for Samsung