There has been a lot of discussion in the market regarding Qualcomm’s next snapdragon 810 manufacturing issues due to alleged overheating. The chipset was specifically manufactured for high-end devices that would appear in 2015 while some of them have already been introduced. Now the reports show that the issues have been resolved. Digitimes report reveals that the semiconductor giant has agreed upon a unified solution and the chipset has now entered mass production.

The LG G Flex 2 and Mi Note Pro both feature a Snapdragon 810 SoC and are clear demonstration of everything is well. Mi Note Pro will be shipped around January 27 and LG G Flex 2 is now ready for pre-orders.

This is the first time Qualcomm is using big. LITTLE architecture with its chipset. The important aspects is that it deploys 20nm fabrication process and utilizes 4 powerful Cortex-A57 cores for performance demanding situations and 4 energy-efficient Cortex-A53 cores for battery conservation the rest of the time. Both sets of cores are enough to handle toughest computational cases.

Qualcomm has finally resolved Snapdragon 810 overheating issues